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Semiconductors & Functional · Wide-bandgap semiconductor

Gallium nitride (GaN)

Wide-bandgap (3.4 eV) semiconductor enabling blue LEDs and high-frequency, high-power electronics.

Typical properties

Published ranges for the usual condition. Heat treatment, section size and product form move these numbers — a starting point for a search, not design allowables.

Band gap 3.4 eV (direct)
Breakdown field ~3.3 MV/cm
Structure wurtzite

Where it sits in the field

Strength against density for 25 engineering materials A logarithmic property chart. Density runs from 0.8 to 12 grams per cubic centimetre on the horizontal axis and strength from 10 to 3000 megapascals on the vertical axis. Each material is drawn as a vertical capsule spanning its published strength range, coloured by material class. 1 1.5 2 3 5 8 10 10 30 100 300 1000 3000 Density ρ (g/cm³) Strength σ (MPa) AISI 1045 carbon steel — ρ 7.85 g/cm³, tensile strength 565–850 MPa AISI 4140 (42CrMo4) — ρ 7.85 g/cm³, tensile strength 900–1200 MPa AISI 304 / 1.4301 stainless — ρ 7.9 g/cm³, tensile strength 515–720 MPa AISI 316L / 1.4404 stainless — ρ 8 g/cm³, tensile strength 485–620 MPa 17-4PH (1.4542) — ρ 7.75 g/cm³, tensile strength 930–1310 MPa Ductile iron EN-GJS-400-15 — ρ 7.1 g/cm³, tensile strength 400 MPa Aluminum 6061-T6 — ρ 2.7 g/cm³, tensile strength 310 MPa Aluminum 7075-T6 — ρ 2.81 g/cm³, tensile strength 572 MPa Ti-6Al-4V (Grade 5) — ρ 4.43 g/cm³, yield strength 830–1100 MPa Magnesium AZ31B — ρ 1.77 g/cm³, yield strength 150–220 MPa Copper Cu-ETP (C11000) — ρ 8.94 g/cm³, yield strength 70–330 MPa Cartridge brass C26000 (CuZn30) — ρ 8.53 g/cm³, tensile strength 300–900 MPa Bearing bronze C93200 (SAE 660) — ρ 8.9 g/cm³, tensile strength 240 MPa Monel 400 (NiCu30Fe) — ρ 8.8 g/cm³, yield strength 240–480 MPa Inconel 718 — ρ 8.19 g/cm³, yield strength 1030 MPa Hastelloy C-276 — ρ 8.89 g/cm³, yield strength 355 MPa Alumina Al₂O₃ (99.5 %) — ρ 3.9 g/cm³, compressive strength 2500 MPa Zirconia Y-TZP (3Y) — ρ 6.05 g/cm³, flexural strength 900–1200 MPa Silicon nitride Si₃N₄ — ρ 3.2 g/cm³, flexural strength 700–1000 MPa Polyamide PA66 (nylon) — ρ 1.14 g/cm³, tensile strength 80 MPa Polycarbonate (PC) — ρ 1.2 g/cm³, tensile strength 65 MPa PEEK — ρ 1.3 g/cm³, tensile strength 100 MPa PTFE (Teflon) — ρ 2.2 g/cm³, tensile strength 25 MPa CFRP (carbon/epoxy laminate) — ρ 1.55 g/cm³, tensile strength (0°) 1200–2000 MPa GFRP (glass/epoxy or polyester) — ρ 1.9 g/cm³, tensile strength 300–1100 MPa
Metals & Alloys (16) Ceramics & Glasses (3) Polymers & Elastomers (4) Composites (2) 25 of 37 library materials publish both a density and a strength. Bars span the published range; the dot is its midpoint.

Where it is used

LEDs, laser diodes, fast chargers, RF amplifiers, EV inverters.

Processing and joining

MOCVD epitaxy on sapphire/SiC/Si; GaN-on-Si for power devices.

Class behaviour

Gallium nitride (GaN) is a semiconductors & functional materials material: covalent (si, gaas) or ionic-covalent; band gap defines electronic behavior.

That bonding is what produces the class-level trade-off you inherit here — tunable electronic/optical properties via doping and heterostructures, set against brittle; extreme purity/processing requirements.

At a glance

Category
Semiconductors & Functional
Subcategory
Wide-bandgap semiconductor
Class
Semiconductors & Functional Materials
Reference
gan

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